Category: PCB Technology

A revolutionary innovation in the electronics industry - Ticer TCR®

Technological requirements for PCBs are constantly increasing and component density is raising rapidly. To meet these requirements, new technologies and materials are being developed. The thinfilm resistive foil Ticer TCR® is one of these materials. We’re going to highlight some key characteristics and advantages of Ticer TCR® in this blog.

Embedding discrete components into a PCB

The embedding of components addresses all critical challenges of today’s electronic systems and, as such, is a highly attractive solution for OEMs. Embedding allows for further miniaturisation with improved thermal management and increased reliability.