Does the term Through Hole Filling mean anything to you? If not, we'll explain in this blog post what copper-filled holes are all about and what their advantages are.
Technological requirements for PCBs are constantly increasing and component density is raising rapidly. To meet these requirements, new technologies and materials are being developed. The thinfilm resistive foil Ticer TCR® is one of these materials. We’re going to highlight some key characteristics and advantages of Ticer TCR® in this blog.
Keeping cell phones and and other devices "cool." PCBs with thermal or electrical heat dissipation now available in series production
High temperatures are generated when using telecommunication modules and LED lighting systems. Improved heat dissipation and cooling is therefore required to extend the service life of a product. Special printed circuit board technologies enable heat dissipation even for the smallest electronic devices.
The embedding of components addresses all critical challenges of today’s electronic systems and, as such, is a highly attractive solution for OEMs. Embedding allows for further miniaturisation with improved thermal management and increased reliability.