Special technologies
The constant search for new processing technologies and customer solutions means that VARIOPRINT is always one step ahead
The diversity of customer requirements is enormous. Outside the usual product range, VARIOPRINT can offer a great deal of expertise and years of experience when it comes to solutions for special applications.
Whether slip ring boards for gyro flex compasses in the shipping industry, embedded heat sinks for communication systems or wafer products for the semiconductor and sensor industries, VARIOPRINT has a solution in every field. With our highly trained and broad engineering team consisting of process and product engineers and even materials scientists, we support you from the development phase to mass production of the finished product.
Highlights of our portfolio include the electro-optical circuit boards developed by vario-optics, which we are the world's first manufacturer to produce en masse for data communication and sensor applications. In this field, we are setting a global standard for a new technology in PCBs.
Performance range
Design and technology Blind vias, buried blind vias, µ-vias with and without copper fill and plugged vias with/without overplating.
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| Dimension and formats Thickness 0.1 mm to 4.8 mm Format up to 570x420 mm Panel formats used 305x460 mm and 460x610 mm |
Solder resists and additional prints Registration solder mask Additional prints, such as legend print, peelable mask and carbon print
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Conductive pattern structuring Copper cladding from 18 μm to 210 μm Conductor widths and spacings Standard: 75 µm / 100 µm Special: 50 µm / 50 µm
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Mechanical machining Annular rings |
| Materials TG 135 °C and high TG 170 °C FR4 Halogen-free materials PTFE materials Polyimide (Kapton) and special materials such as LCP (Liquid Crystal Polymers) |
| End surface Various chemical and galvanic gold surfaces and chemical tin and silver surfaces, as well as pure organic protective coatings |
| Electroplating and copper plating Aspect ratio of up to 1:12 with 0.15 mm drill diameter 1:15 at 0.3 mm drill diameter Copper in vias in accordance with IPC II, IPC III or customer specific
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