Thanks to the latest bath perfusion methods, we achieve exact interconnect edges and a uniform homogenous copper distribution on the panel, especially in the production of high-frequency circuit boards. This enables us to guarantee the optimum process, in particular for printed circuit boards in high-frequency ranges.

With the latest vertical electroplating plant, the most modern in Europe, which uses inert anodes instead of copper anodes, we can ensure an accurate copper layer structure in the holes due to lower surface scattering. An aspect ratio of up to 1:16 enables extreme design requirements to be implemented successfully.