Europe's largest and most advanced laser department complements our mechanical expertise in cutting and drilling technology.
By selecting the most suitable option from the various laser systems available, we guarantee the most cost-effective manufacturing of products for our customers.
We use modern laser direct imaging (LDI) systems, not only in drilling and cutting technology, but also in the exposure of the inner and outer layer structures. Thanks to this new production technology, we can now reliably produce fine line structures of 50 µm.
Our latest investment in a Schmoll Combi-Drill laser system allows for much more efficient drilling of MicroVias. The Combi Laser Systems with premium CO2 and UV lasers, as well as a 3-axis CNC controlled system, guarantees maximum precision. Due to the high precision machining results, ever-increasing design requirements such as closer tolerances in the Z-axis for cavities and bending zones can be realized even more precisely.
In addition to the high throughput, the flexibility is a major advantage. In addition to MicroVias, the system also offers cutting of complex contours. More and more frequently, different materials such as polyimide coverlays or HF-teflon materials have to be structured by the laser technology for flexible and rigid-flexible circuit boards. This is where the new Combi-Drill system stands with its decisive advantages.
VARIOPRINT currently has a capacity of just under 20 laser sources. The latest pico laser technology uses a cold laser ablation and therefore reduces the carbonation of PCBs. Based on the technological requirements and material selection, we choose the best laser technologies for you:
- Latest generation of pico laser systems
- Dual systems with UV & CO2 laser sources
- Pure UV laser systems for efficient contouring