High temperatures are generated when using telecommunication modules and LED lighting systems. Improved heat dissipation and cooling is therefore required to extend the service life of a product. Special printed circuit board technologies enable heat dissipation even for the smallest electronic devices.
Miniaturization and rapid scaling of electronic devices are the driving forces for both chip manufacturing and printed circuit boards. So it's no surprise that the two have teamed up to develop the world's thinnest infrared sensor - just 0.17 mm thick. Read on to learn how this was achieved and what products will be coming to market soon.
Insights you don’t want to miss: We are going to present our latest technological and capability-based advances in radio and high frequency circuits at the International Microwave Symposium (IMS) in Denver, June 19-24, 2022. Meet the Varioprint team at booth #11042 and explore longboards, planar circuits, fine line, and other advances.
Oversized PCBs are key to many advanced applications like, for example, 5G antennas. Varioprint’s state-of-the-art intralogistics setup can support the efficient and effective production of high-volume longboards.
The embedding of components addresses all critical challenges of today’s electronic systems and, as such, is a highly attractive solution for OEMs. Embedding allows for further miniaturisation with improved thermal management and increased reliability.
Reproducing micro conductors without base material as a carrier is a challenge for many PCB manufacturers. Yet not for Varioprint where we realised fully exposed flying conductors for medical PCB applications.
