VARIOPRINT offers a wide range of different metal core technologies and solution concepts for improved heat dissipation.
Using full-surface metal cores made of copper, brass or aluminium, as well as partially incorporated inlays (coins), enables a significantly higher amount of heat to be dissipated through the heatsink. High-precision depth milling exposes the metal body and, in conjunction with edge metallisation, creates a much larger cooling surface. Optimised thermal management leads to overall cost reduction and higher system reliability.
Our state-of-the-art manufacturing equipment, including drilling and milling machines especially designed to work in conjunction with camera metrics, ensures innovative and high quality products.
Design and technology
Blind vias, µ-vias with and without copper fill, plugged vias and isolated plated-through vias in the metal body.
| Dimension and formats
Thickness up to 4.8 mm including metal core
Format up to 265x419 mm
Panel formats used 305x460 m
Solder resists and additional prints
Additional prints such as legend print, peelable mask and carbon print
| Conductive pattern structuring
Copper cladding from 18 μm to 210 μm
Conductor widths and spacings
Standard: 75 µm / 100 µm
Special: 50 µm/50 µm
PTFE substrates with pre-laminated copper or brass core. Inserted copper cores and substrates on subsequently pressed heatsink (post-lamination), as well as thermally conductive special materials, such as those produced by Bergquist or Laird.
| End surfaces
Various chemical and galvanic gold surfaces and chemical tin and silver surfaces, as well as pure organic protective coatings.
| Electroplating and copper plating
Aspect ratio of up to 1:15 with 0.3 mm drill diameter
Copper in vias in accordance with IPC II, IPC III or customer specific